Next-GEN. Battery 乕丂俵倎倲倕倰倝倎倢倱 & System Supply for LIB, LMB and NaIB        

Products                     Closed Pack Porous Structure Electrode, See below



High Conductivity Binder for High Voltage type Electrode Application    New
                      - Ion Conductive Binder  PIOXCEL-

                     New binder has excellent conductivity at 倶10^-4 S/cm.丂

                 Hi Conductivity Binder丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂Solution Spec.
Cathode use丂  CBC-54N20S丂          20% conc. in NMP solution丂 嘳10^-5丂S/cm
丂丂丂丂丂丂       CBC-54N20H丂          20% conc. in NMP solution丂 X 10^-4丂S/cm丂丂
丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂丂   丂丂丂
Anode use丂丂  CBA-92N20S             20% conc. in NMP solution丂 嘳10^-5丂S/cm
丂丂丂丂丂丂       CBA-92N20H丂          20% conc. in NMP solution丂 嘳10^-4丂S/cm
                  丂丂丂 丂丂丂丂丂     Use solvent in different kind, please consult us.

Characteristics
This high conductive binder has a specific funtion performing remarkably refraining a grain boundary onsurface ofactive materials.In a typical application, high Nickel content of Active material such as NCM811 isoriginally sufferedOxiding deterioration upper 4.0Voltage range. Our recommending binder could solve thissubject by coating aconductive polymer layer on the surface to protect such oxidization in the Celloperation.  In addition, this highconductivity bainder is also feasible for recipe with Solid State Electrolytein SSE battery field.



Conductive Adhesives for Cathode and Anode electrodes

丂CB Series丂丂丂Summary
This is composed by Polyvinylidene fluoride polymerized with Ionic Liquid.
It is available to make electrodes having an ideal conductive network with
strong enough in bonding and elastic adhesive properties to obtain a close-
packed structure by a proper mixing with conductive agents.
                         
                           Ion Conductive Binder

PIOXCEL CBC5030FP High Dispersion Powder form
丂丂            Binding structure Characteristic data




Specific bonding force
as丂pedestal adhesion form

Bonding site-Elastic property







Conventional PVdf Electrodes(SEM photos) Close-packed Electrodes(SEM photos)





Interface SEM



Cross section SEM


Conventional PVdF binder in hard and lump
bonding form
  Evaluation
           Flexibile structure adhesion        



Conventional PVdF binder(2.6g/cc)

CB Binder (2.8g/cc)


Press density


Many cracks and broken from hard bondingproperty
No cracks and broken by the elastic
bonding property.


丂Product Table


丂丂丂丂丂丂Cathode Use




丂丂丂丂丂












丂丂丂丂 丂Anode Use (solvent application)




丂丂丂丂












(仸) This grade is applicable for close-packed structure to enhance dispersible effect of conductive agent.


Characteristics of CB Binder
丂丂丂丂1.丂CB binder support improving IR drop property through forming Closed Pack structure of Electrodes layer.
丂丂丂丂2.丂Standard dosage in use of CB binder is to reduce by one third volume of Conductive agent and the balance of the
            predetermined total recipe 倱hould be added with active agent which means contributing an improvement of
            Volumetric Energy Density.
丂丂丂丂3.丂CB binder performs superior low temperature property to that of conventional PVdF binder.
丂丂丂丂4.丂A bonding part of each particle is formed at point by point to improve electrode density and also its parts are elastic
            property suitable for absorbing to some degree against swelling and shrinking property of Silicone and even graphite
            active materials as well as possible to increase a press density of electrode at least more 10 to 20 % than that of
            conventional PVdF.













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