Products Closed Pack Porous Structure Electrode, See below
High Conductivity Binder for High Voltage type Electrode Application New
- Ion Conductive Binder PIOXCEL-
New binder has excellent conductivity at ｘ10^-4 S/cm.
Hi Conductivity Binder Solution Spec.
Cathode use CBC-54N20S 20% conc. in NMP solution Ⅹ10^-5 S/cm
CBC-54N20H 20% conc. in NMP solution X 10^-4 S/cm
Anode use CBA-92N20S 20% conc. in NMP solution Ⅹ10^-5 S/cm
CBA-92N20H 20% conc. in NMP solution Ⅹ10^-4 S/cm
Use solvent in different kind, please consult us.
Characteristics
This high conductive binder has a specific funtion performing remarkably refraining a grain boundary onsurface ofactive materials.In a typical application, high Nickel content of Active material such as NCM811 isoriginally sufferedOxiding deterioration upper 4.0Voltage range. Our recommending binder could solve thissubject by coating aconductive polymer layer on the surface to protect such oxidization in the Celloperation. In addition, this highconductivity bainder is also feasible for recipe with Solid State Electrolytein SSE battery field.
Conductive Adhesives for Cathode and Anode electrodes |
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| CB Series Summary | |||||||||
| This is composed by Polyvinylidene fluoride polymerized with Ionic Liquid. It is available to make electrodes having an ideal conductive network with strong enough in bonding and elastic adhesive properties to obtain a close- packed structure by a proper mixing with conductive agents. |
 Ion Conductive Binder |
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| PIOXCEL CBC5030FP High Dispersion Powder form | |||||||||
| Binding structure Characteristic data | |||||||||
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Specific bonding force
as pedestal adhesion form |
Bonding site-Elastic property |
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| Conventional PVdf Electrodes(SEM photos) | Close-packed Electrodes(SEM photos) | ||||||||
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Interface SEM |
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Cross section SEM |
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| Conventional PVdF binder in hard and lump bonding form |
Evaluation |
Flexibile structure adhesion | |||||||
Conventional PVdF binder(2.6g/cc) |
CB Binder (2.8g/cc) |
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Press density |
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| Many cracks and broken from hard bondingproperty | No cracks and broken by the elastic bonding property. |
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| Product Table | |||||||||
| Cathode Use | |||||||||
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| Anode Use (solvent application) | |||||||||
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| (※) This grade is applicable for close-packed structure to enhance dispersible effect of conductive agent. | |||||||||
| Characteristics of CB Binder | |||||||||
| 1. CB binder support improving IR drop property through forming Closed Pack structure of Electrodes layer. | |||||||||
| 2. Standard dosage in use of CB binder is to reduce by one third volume of Conductive agent and the balance of the predetermined total recipe ｓhould be added with active agent which means contributing an improvement of Volumetric Energy Density. |
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| 3. CB binder performs superior low temperature property to that of conventional PVdF binder. | |||||||||
| 4. A bonding part of each particle is formed at point by point to improve electrode density and also its parts are elastic property suitable for absorbing to some degree against swelling and shrinking property of Silicone and even graphite active materials as well as possible to increase a press density of electrode at least more 10 to 20 % than that of conventional PVdF. |
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